Introduction to the application of PI film in the manufacturing of flexible copper laminates
Release Time：
2023-06-06
Source：
The largest application area for polyimide (PI) films today is flexographic printed circuit boards. With the rapid development of electronic products, the electronic assembly technology has put forward one serious challenge after another. In order to meet the development of electronics technology, bold innovations in electronic assembly technology have been made, and in this context a flexible circuit (flex circuit) containing delicate wires and manufactured with thin, flexible polymer films has been created, which can be applied to surface mount technology and can be bent into numerous desired shapes.
Flexible circuit boards (FPCs) using SMT technology can be manufactured very thin and compact, with insulation thicknesses of less than 25 μm. These flexible circuits can be bent at will and can be rolled and placed into a cylinder to make full use of the three-dimensional volume. It breaks the conventional stereotype of the inherent use of area, thus creating the ability to take full advantage of the volume shape, which can significantly increase the effective use density in terms of the length of conductors used per unit area, which is currently used routinely, to form a high-density assembly form. The use of flexible circuits has expanded in recent years to include radio communications, computers, and automotive electronics. Previously used exclusively as an alternative to rigid cables, flex circuits are well established as a substitute for rigid circuits and printed circuit boards in applications requiring thin or three-dimensional circuits. In order to meet the requirements of rigid-flex applications, rigid-flex technology combines flex circuits (i.e., rigid-flex printed circuit boards) with rigid circuit boards.
The main materials used in general flex circuits (3-layer method of FPC) are insulating film (insulation layer), adhesive, and wires (conductive layer). The insulating film forms the base of the circuit and constitutes the insulation layer of the flexible circuit substrate. The adhesive bonds the copper foil to the insulating booklet film, and in the multilayer structure design, a number of internal layers are bonded together. An outer protective layer (cover film) is used to isolate the electricity from dust and moisture, and at the same time to reduce the stress during flexing. The conductive layer is provided by a copper foil. In some flex circuits, reinforcing plates (made of aluminum, stainless steel, composite materials, etc.) are used as reinforcing ribs to ensure geometric stability. It also provides mechanical support during component and connector insertion, as well as stress relief.
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2023-06-19
2023-06-06
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